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Investing in Manufacturing

Investment in our Weymouth manufacturing facility continues apace despite the challenges of the pandemic. 

We are strengthening our capabilities in order to meet a wider range of customer requirements.

The latest additions to our manufacturing equipment include:

Amadyne EMU Table Top Micro Assembly System - this new system will enhance our existing die bond capability by adding high accuracy semi-automated die bonding. The EMU enables the manufacturing of technologies including chip-on-board and multichip modules. It also incorporates an automated chip eject system and epoxy dispenser in the same platform.

XYZTEC Semi-Automated Pull and Shear Bond Tester – XYZTEC is a technology leader in bond testing, and the Condor-Sigma bond tester adds important capability to check and inspect the quality of our work. The Condor-Sigma is the most advanced bond tester we could find on the market, and has the capability to perform all commonly used industry tests as well as special and challenging applications.

F&S Bondtec 5380 Aluminium Wedge Bonder – to complement our existing gold ball wire bond capability we are also adding Aluminium wedge bonding. This gives us more flexibility to address different types of assembly and meet many more customer requirements, including low profile assemblies and wire bonding to different types of substrates.

Series 58xx bonders feature exchangeable wedge-wedge bond heads. By adding the Aluminium head to our existing gold ball bond head we are able to upgrade our capability to the next level.

Contact us to find out more about how we can help with your requirements.